Gennex represents a leading PCB manufacturer specializes in multilayer printed circuit board and flexible circuit. Our team continuously strives to provide high quality products and exemplary service to meet the customer requirements.
The following technical specifications for the rigid and flexible circuit boards are made to ISO 9002 standards and with U/L approval.
|
|
 |
|
Line
width/Line spacing
|
:
3/3 mils |
|
Number of Layers |
: up
to 18 layers |
|
Layer to Layer Registration
|
:
±
4 mils (0.1mm) |
|
Min.
SMT Pitch |
: 8
mils (0.2mm) |
|
Impedance Control
|
:
±
7% |
|
Min.
Drill Hole Diameter
|
: 8
mils (0.2mm) |
|
Min.
Via Size
|
: 6
mils (0.15mm) |
|
Hole
to Hole Tolerance |
:
±
2 mils (0.05mm) |
|
Hole
to Edge Tolerance
|
:
±
4 mils (0.01mm) |
|
Micro Via
|
: 4
mils (0.1mm) |
|
Hole
Aspect Ratio
|
: 1:
8 |
|
Solder mask
|
:
Liquid-imageable and conventional UV-curing |
|
Soldermask Bridge between Solder Dam
|
:
2.5 mils |
|
Soldermask Registration Tolerance
|
:
±
2 mils |
|
Surface Finishing
|
:
Hot Air Solder Leveling, OSP, ENIG, Immersion
Tin, Electrolytic Gold |
|
Inspection |
:
Automatic Optical Inspection
- Open/short testing
- Double sided SMD of 0.012” pitch |
|
1k/10k clean room |
:
Artwork plotting, Wet/Dry film, Lamination |
|
Artwork generation
|
:
CAM workstation/Laser plotter |
|
Data
transfer |
:
Dedicated FTP server |
