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PCB Capability
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FPC Capability
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Rigid-Flex Capability |
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PRINTED CIRCUIT BOARD
FPC Capability |
Gennex represents a leading PCB manufacturer specializes in multilayer printed circuit board and flexible circuit. Our team continuously strives to provide high quality products and exemplary service to meet the customer requirements.
The following technical specifications for the rigid and flexible circuit boards are made to ISO 9002 standards and with U/L approval.
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Line
width/Line spacing |
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2 mils (0.05mm) |
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Copper Thickness |
: 1/3 oz Min |
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Layer to Layer Registration |
: ± 5 mils |
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Min. Drill Hole Diameter |
: 6 mils (0.15mm) |
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Min. Via Size |
: 4 mils (0.1mm) |
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Micro Via |
: 4 mils (0.1mm) |
Surface Finishing
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: Hard Gold, ENIG, Hasl, OSP, Tin Lead Plating, Immersion Tin |
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Cover Layer |
: Polyimide/Flexible Soldermask |
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Stiffener Material |
: Polyimide/FR4/Metal |
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Shielding Material |
: Copper/Silver Ink |
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Tooling Tolerance |
: ± 1 mils (0.025mm) |
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ZIF Tolerance |
: ± 2 mils (0.05mm) |
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