Gennex represents a leading PCB manufacturer specializes in multilayer printed circuit board and flexible circuit. Our team continuously strives to provide high quality products and exemplary service to meet the customer requirements.
The following technical specifications for the rigid and flexible circuit boards are made to ISO 9002 standards and with U/L approval.
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SRD (Steel Rule Die) division outline, distance of the trace to the outline |
:
>=15 mils |
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MF (Male Female) punch outline, distance of the trace the outline |
: >=10 mils |
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Laser outline, distance of the trace to the outline
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: >=4 mils |
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Distance of the silkscreen to the coverlay |
: >=15 mils |
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Distance of the silkscreen to outline as |
SRD: >=20 mils
MF: >=15 mils |
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Coverlay distance to trace |
: >=6 mils |
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Coverlay |
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Coverlay registration (mm) |
: 0.15 |
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Soldermask |
: 0.08 |
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Silver film to pad |
: 0.13 |
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Coverlay to trace |
: 0.13 |
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Legend |
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Legend high (min) |
: 0.8 |
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Legend width (min) |
: 0.13 |
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Legend space (min) |
: 0.13 |
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Legend registration tolerance |
: 0.2 |
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Impedance |
: 10% |
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Plated Copper |
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General Thickness |
: 1.0-1.4mils |
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Plating Tolerance |
: ± 0.2mils |
